IEEE transactions on bio-medical engineering
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This paper describes the scaling limitations of multichannel recording probes fabricated for use in neurophysiology using silicon integrated circuit technologies. Scaled silicon probe substrates 8 microns thick and 16 microns wide can be fabricated using boron etch-stop techniques. Theoretical expressions for calculating the thickness and width of silicon substrates have been derived and agree closely with experimental results. ⋯ The probe shank dimensions can be designed to vary the strength and stiffness for different applications. The scaled silicon substrates have a fracture stress of about 2 x 10(10) dyn/cm2, which is about six times that of bulk silicon, and are strong and very flexible. Scaling the feature sizes of recording electrode arrays down to 1 micron is possible with less than 1 percent electrical crosstalk between channels.